PCB Prototype Assembly
Rapid Prototype PCB Assembly 13 Years of First-Time-Right Excellence
Accelerate your product development with our 24-hour prototype service, leveraging 13 years of expertise to achieve >99% first-pass success rate for critical designs.We bridge R&D and mass production through:
- Co-Engineering Support: Free DFM analysis within 6 hours on Gerber/BOM files, resolving signal integrity issues (e.g., impedance control ±5%) and thermal risks pre-production 46.
- Agile Scalability: Seamless transition from 1-piece prototypes to 10K+ batches via MES-driven lines, with same-day PCB fabrication (max 680×550mm panel) 25.
- Supply Chain Resilience: Direct sourcing from Arrow/Avnet/Digi-Key + obsolescence management, slashing component lead time to 48 hours for 90% parts.
- Supply Chain Resilience: Direct sourcing from Arrow/Avnet/Digi-Key + obsolescence management, slashing component lead time to 48 hours for 90% parts.
Precision Prototyping Technologies
A. Advanced Assembly & Packaging
- Micro-Scale Expertise: Handles 0.15mm QFP, 0.2mm BGA, and 0201 components with nitrogen reflow (void rate <20%), validated by 3D AOI/X-ray 24.
- Flex/Rigid-Flex Mastery: Supports 32-layer HDI designs with laser-drilled microvias (tolerance ±10μm) and impedance-controlled routing (<0.5dB loss at 10GHz) 46.
B. Design-to-Testing Integration
- HyperLynx-Driven Validation: Pre-layout signal integrity simulation for DDRx interfaces and analog/mixed-signal circuits, reducing EMI risks by 70% 6.
- IoT-Enabled Testing: In-circuit (ICT), functional (FCT), and thermal cycling (-40°C~125°C) with cloud-synced reports .
Proactive Risk Mitigation
- Real-Time Process Control: Strictly monitors reflow profiles (±3°C) and halts lines if solder defects exceed IPC-A-610 Class 3 limits 4.
- X-ray/AOI Combo: 100% inspection of hidden joints and micro BGAs, with CAD-to-assembly alignment 7.
- Full Material Traceability: Component batch data + test logs accessible via client portal for ISO 13485/IATF 16949 compliance
Key Prototype Parameters
| Parameter | Capability | Standard/Evidence |
| Max PCB Size | 680 × 550mm | Custom panelization |
| Min. BGA Pitch | 0.2mm | X-ray validation 2 |
| SMT Placement Accuracy | ±25µm | IPC-9851 |
| Microvia Drilling Tolerance | ±10μm | Laser HDI 4 |
| Lead Time (1-10pcs) | 24 hours (SMT) / 48 hours (full turnkey) | MES analytics |
| Thermal Cycling Range | -40°C to 125°C | IEC 60068 4 |
