PCBAs Capabilities
End-to-End PCBA Manufacturing Capability | 13 Years of Precision
Leveraging 13 years of expertise, we provide full-spectrum PCBA solutions from prototyping to mass production,supported by:
- Multi-Technology Integration: Advanced SMT (60,000 CPH, ±30µm accuracy), THT, and mixed assembly for complex designs including HDI, rigid-flex, and high-layer count boards (up to 38 layers)56.
- Material Mastery: Certified sourcing from Arrow/Avnet/Digi-Key, with options for ENIG, OSP, or immersion silver finishes to match signal integrity and environmental needs.
- Scalable Capacity: 5,000㎡ facility with 6 SMT lines, monthly output of 10k㎡ PCBA, supporting batches from 1-piece prototypes to 1M+ volume.
Specification | PCBA Capability |
| Placer speed | 600,000 chips/hour |
| Lead Time | 25+ Days (To Be confirmed) |
| SMT | SMT, Through Hole Assembly Single/Double-Side SMT, Single/Double-Sides Mixture Assembly |
| PCB Size | 50mm×50mm ～610mm×508mm |
| PCB Thickness | 0.5mm～4.5mm |
| Min. diameter /space of BGA | 0.2mm/0.35mm |
| Qualifications | ISO 9001:2015 |
| Accuracy | <±30µm, under the condition of 3σ，CPK≥1 |
| Minimum width/space of QFP | 0.15mm/0.25mm |
| Minimum Diameter /Space of BGA | 0.2mm/0.35mm |
| Reliability Test | Flying Probe Test/Fixture test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, and Micor Metallographic Section Analysis, etc. |
Precision-Driven Process Technologies
SMT & Micro-Assembly
Fine-Pitch Expertise: Handles 0.15mm QFP, 0.2mm BGA, and 0201 components via nitrogen reflow (void rate <20%)56.
Complex Packaging: POP, QFN, LGA, and μBGAs placement validated by 3D AOI and X-ray imaging57.
Through-Hole & Hybrid Assembly
Robust Mechanical Bonding: Selective wave soldering for connectors/power modules, with torque-controlled insertion (IPC-A-610 Class 3)68.
ESD-Sensitive Handling: Cleanroom (Class 8) for medical/automotive PCBA, preventing static damage during
assembly28.
Value-Added Services
Conformal Coating: Automated spray for moisture/dust resistance (IP67 validation per IEC 60529)48.
DFM Optimization: 24-hour feedback on Gerber/BOM files to prevent tombstoning, voiding, or thermal stress failures510.
Zero-Defect Execution | Traceable & Certified）
Intelligent Quality Gates
Real-Time Monitoring: MES system tracks process parameters (e.g., reflow profile ±3°C) and auto-halts lines if defects exceed thresholds48.
Comprehensive Testing: In-circuit (ICT), functional (FCT), boundary scan, and 48hrs ESS testing under -40°C~125°C for automotive/medical grades47.
Full Traceability: Component-level data (batch, date, test logs) accessible via cloud portal for RCA and compliance reports410.
Certifications: IATF 16949 (automotive), ISO 13485 (medical), IPC-A-610H Class 3, UL/CB safety compliance25.
Agile Manufacturing Powered by Industry 4.0
Rapid Turnkey Service: 12-hour PCB prototyping, 24-hour sample delivery, and flexible batch scheduling (on-time rate >99.5%)24.
Global Logistics: Hub-based shipping from Thailand/China factories, with expedited air options for urgent orders
Industry-Tailored PCBA Solutions
| Industry | Capability Highlights | Key Metrics | |
| Automotive | Vibration-resistant designs • AEC-Q200 components • Extended temp range (-40°C~150°C) | 0 field failures (past 24 months) | |
| Medical | Compatible coatings • RoHS/REACH compliance • Cleanroom assembly | 99.98% sterile packaging yield | |
| Industrial IoT | DIN-rail mounting • Conformal coating for corrosive env. • Wireless module pre-pairing | 10-year lifespan guarantee | |
| High-Frequency | Impedance-controlled routing (±5%) • Low-Dk materials • EMI shielding | <0.5dB signal loss at 10GHz | |
