Circuit Board PCB Assembly Factory
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PCB Production Capacity
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Layer Capabilities:
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1 to 58 layers
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Materials:
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CME1, CME3, FR-4, High TG FR4, Halogen free FR4, Polyimide, aluminum, Ceramic(96% Alumina) Teflon, PTFE（F4B，F4BK）,Rogers（4003, 4350,5880）Taconic（TLX-8，TLX-9）, Arlon（35N、85N） etc.
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Board Sizes:
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Up to 800 × 508 mm (32″ x 20″)
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Material Mixed Laminate:
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4 layers -10 layers(FR4+Ro4350, FR4+Aluminum, FR4+ FPC)
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Precision Tolerances:
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Min track/gap of 0.075 mm, and dielectric thickness down to 0.1 mm
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Minimum trace width and spacing:
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0.075mm/0.075mm(3mil/3mil)
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Minimum finished hole diameter:
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0.15mm(6mil).0.1mm(4mil)for HDI
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Surface finishes offered:
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HASL(with lead),HASL(Lead free),Au and Nikle Gold plating, OSP, ENIG, ENEPIG, Immersion silver,Immersion Tin
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PCBA Production Capacity
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SMT Lines:
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6 lines, capable of 7 million placements daily
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Versatility:
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Handles everything from prototyping to large-scale production with no MOQ
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Solder Types:
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Water Soluble, Leaded, and Lead-Free options available
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Testing & Quality Control:
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Includes X-Ray, AOI, ICT, Flying Probe, Burn-in, and Function Testing
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Component Range:
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0201 to BGA, CSP, and QFP
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Speed & Efficiency:
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0.15 sec/chip, 0.7 sec/QFPa
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Through-Hole Assembly:
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25,000 units per month
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THT Equipment:
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4 automatic soldering/testing lines
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THT Full-Time Production Staff:
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120+
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Certifications held:
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ISO 9001, ISO 13485, IATF 16949, RoHS.
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Technical Details
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Min Components size
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0201-54 sq.mm (0.084 sq.inch),Long Connector,CSP,BGA,QFP
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Speed
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0.15sec/chip, 0.7sec/QFP
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Max.PCB Width:450mm
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Min.PCB Width:unlimited
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Wave-Solder
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Components Height:Top 120mm/Bot 15mm
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Metal Types:Part,Whole,Inlay,Side-step
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Metal Material:Copper,Aluminum
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Sweat-Solder
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Surface Finish:Plating Au,Plating Silver,Plating Sn
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Air Bladder Rate:less than 20%
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Press Range:0-50KN
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Press-fit
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Max.PCB Size:800*600mm
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SMT and Thru-hole
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Solder Type
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Water Soluble Solder Paste,Leaded and Lead-Free
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File Formats
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BOM ,Gerber Files,Pick-N-Place Files(XYRS)
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Type of Service
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Turn-Key,Partial Turn-Kye or Consignment
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Component Packaging
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Cut Tape,Tube Reels Loose,Parts
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Testing
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X-RAY Inspection,AOI Testing ICT,Flying Probe,Burn-in,Function Test
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Description
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