Mastering Hybrid Assembly Complexity
“With 13 years of solving mixed-technology challenges, we bridge the gap between high-density SMT and robust THT requirements.
Our IPC-certified engineers leverage dual-process expertise to conquer.”
Thermal Conflict Resolution – Preventing reflow damage to through-hole components
Selective Soldering Precision – 0.1mm nozzle accuracy for SMT/THT coexistence zones
Material Compatibility – Optimizing solder pastes/fluxes for hybrid processes
Hybrid Assembly Technology Matrix
| Challenge | Our Solution | Technical Edge |
| High-Density + High-Power | SMT 01005 + 10oz copper THT | Thermal relief pads + stepped stencils |
| Fine-Pitch BGAs + Press-Fit | Bottom-side SMT + top-side force insertion | Dedicated no-clean flux chemistry |
| Flex-Rigid + Connectors | Sequential lamination + selective soldering | Fixture-less conveyor adaptation |
| Harsh Environment Boards | Conformal coating post dual-process | Robotic spraying with SMT mas |
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Integrated Production Flow
Hybrid Assembly Capability:
Equipment Synergy
SMT/THT Transition: ERP-controlled routing to 3x JBC selective soldering cells
Micro-Soldering: Manual rework stations with 40X magnification (for 0.3mm pitch)
Thermal Management: Nitrogen-inerted reflow ovens + directed convection preheat
Quality Control
Cross-Process AOI: Koh Young 3D inspection pre/post soldering
X-Ray Verification: BGA/through-hole fill analysis in single scan
Reliability Testing:
Thermal cycling (-55°C to +125°C)
Vibration testing (20-2000Hz per MIL-STD-810)
Industry-Proven Applications
| Sector | Case Example | Technology Mix |
| Medical Imaging | MRI Controller Boards | 24L HDI + 200-pin connectors + shielding cans |
| Industrial IoT | Rugged Edge Gateways | Bottom-side PoE magnetics (THT) + top-side 0.4mm BGAs |
| EV Power Systems | Battery Management Units (BMUs) | 10oz copper busbars + 01005 current sensors |
| Aerospace | Avionics Control Modules | Flex-rigid + hermetic connectors + IPC Class 3 |
Hybrid Technology Advantages
Cost Efficiency
30% reduced NPI cycles via concurrent DFM/DFA analysis
Zero cross-contamination between SMT/THT zones
Quality Excellence
99.1% first-pass yield on mixed boards (vs industry avg 96.3%)
Component-level traceability across both processes
Scalability
Prototype to 50k/month volume without line changeover
Dynamic workcell allocation for rush orders
Certified Hybrid Assembly Ecosystem
[ISO 9001:2015] [IATF 16949] [AS9100D] [ISO 13485]
Compliance: IPC-A-610 Class 3, IPC-J-STD-001, IPC-7711/21 Rework
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