Mixed Technology PCBA Solutions

Seamlessly Integrating SMT, THT & Beyond for Your Most Demanding Electronics

Mastering Hybrid Assembly Complexity

“With 13 years of solving mixed-technology challenges, we bridge the gap between high-density SMT and robust THT requirements.
Our IPC-certified engineers leverage dual-process expertise to conquer.”
Thermal Conflict Resolution – Preventing reflow damage to through-hole components
Selective Soldering Precision – 0.1mm nozzle accuracy for SMT/THT coexistence zones
Material Compatibility – Optimizing solder pastes/fluxes for hybrid processes

Hybrid Assembly Technology Matrix

Challenge	Our Solution	Technical Edge
High-Density + High-Power	SMT 01005 + 10oz copper THT	Thermal relief pads + stepped stencils
Fine-Pitch BGAs + Press-Fit	Bottom-side SMT + top-side force insertion	Dedicated no-clean flux chemistry
Flex-Rigid + Connectors	Sequential lamination + selective soldering	Fixture-less conveyor adaptation
Harsh Environment Boards	Conformal coating post dual-process	Robotic spraying with SMT mas

Integrated Production Flow

Hybrid Assembly Capability:

Equipment Synergy
SMT/THT Transition: ERP-controlled routing to 3x JBC selective soldering cells
Micro-Soldering: Manual rework stations with 40X magnification (for 0.3mm pitch)
Thermal Management: Nitrogen-inerted reflow ovens + directed convection preheat

Quality Control

Cross-Process AOI: Koh Young 3D inspection pre/post soldering
X-Ray Verification: BGA/through-hole fill analysis in single scan
Reliability Testing:
Thermal cycling (-55°C to +125°C)
Vibration testing (20-2000Hz per MIL-STD-810)

Industry-Proven Applications

Sector	Case Example	Technology Mix
Medical Imaging	MRI Controller Boards	24L HDI + 200-pin connectors + shielding cans
Industrial IoT	Rugged Edge Gateways	Bottom-side PoE magnetics (THT) + top-side 0.4mm BGAs
EV Power Systems	Battery Management Units (BMUs)	10oz copper busbars + 01005 current sensors
Aerospace	Avionics Control Modules	Flex-rigid + hermetic connectors + IPC Class 3

Hybrid Technology Advantages

Cost Efficiency
30% reduced NPI cycles via concurrent DFM/DFA analysis
Zero cross-contamination between SMT/THT zones

Quality Excellence

99.1% first-pass yield on mixed boards (vs industry avg 96.3%)
Component-level traceability across both processes
Scalability
Prototype to 50k/month volume without line changeover
Dynamic workcell allocation for rush orders