Key advantage
High-Density Expertise: Mastery of HDI, micro passives, and fine-pitch BGAs (down to 0.3mm)
Mixed Technology Support: SMT + THT + press-fit integration
Signal Integrity Focus: Controlled impedance and EMI-safe processes
Thermal Management: Proficient in soldering large thermal pads (QFN, MOSFETs)
End-to-End Testing: Real-use simulation for total reliability
Flexible Scaling: From NPI to mass production
Supply Chain Support: BOM verification, sourcing, obsolescence control


SMT Capabilities
Component Range: 01005 to 45×45mm BGA
Placement Accuracy: ±25μm @ 3σ (CPK ≥ 1.33)
Solder Paste: SAC305, Type 4 (20–38μm)
Reflow: 10-zone nitrogen profile (O₂ ≤ 500ppm)
Inspection: 100% SPI + AOI, X-Ray (BGA voids < 25%)
Testing: ICT + FCT for full electrical/functional validation
Compliance: ISO9001, ISO13485, IATF16949
Service & Support
Prototype Flexibility: MOQ 1 piece, 24h delivery (free stencil + fast proofing)
Mass Production: Fully automated line, long board segmented placement supported
Inline Quality Control: SPI, AOI & X-ray with full report
After-Sales Guarantee: <50ppm complaint rate, free rework for defects

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