PCB production combines advanced technology with meticulous craftsmanship to create reliable circuit boards for modern electronics. Our manufacturing process delivers consistent quality across various PCB types, from simple single-layer boards to complex multilayer designs.
With strict quality control measures and state-of-the-art equipment, we ensure every circuit board meets exact specifications for performance and durability.
The PCB production process begins with careful material selection, using high-grade copper-clad laminates and prepreg materials. Our automated fabrication lines then transform these raw materials into precision circuit boards through a series of controlled steps.
Each production batch undergoes multiple inspections to verify dimensional accuracy, electrical connectivity, and surface quality before shipment.
**Key Advantages of Our PCB Production:**
1. Advanced Manufacturing Capabilities
– Support for boards up to 20 layers
– Laser drilling for microvias (0.1mm diameter)
– High-precision impedance control (±5%)
2. Quality Assurance Systems
– Automated optical inspection (AOI)
– Electrical testing (flying probe and fixture)
– Cross-section analysis for via quality
3. Flexible Production Options
– Quick-turn prototyping (24-48 hour service)
– Volume production with consistent quality
– Custom material selection
**Core Production Equipment:**
1. Lamination Systems
– High-pressure hydraulic presses
– Automated lay-up stations
– X-ray alignment for multilayer boards
2. Drilling and Routing
– CNC drilling machines (0.2-6.35mm)
– Laser direct imaging (LDI) systems
– Precision routing equipment
3. Plating and Coating
– Electroless copper deposition lines
– Electrolytic plating tanks
– Solder mask application systems
4. Testing and Inspection
– Automated optical inspection (AOI)
– Flying probe testers
– Impedance testing equipment
From material preparation to final testing, each PCB undergoes multiple quality checkpoints. The process includes:
1. Inner Layer Processing
– Copper patterning
– Oxide treatment
– Automated inspection
2. Lamination
– Layer alignment
– Press cycle control
– Registration verification
3. Drilling and Metallization
– Mechanical and laser drilling
– Desmear and plating
– Via filling options
4. Outer Layer Processing
– Pattern plating
– Etching
– Solder mask application
5. Surface Finishing
– ENIG, HASL, OSP options
– Gold plating
– Carbon printing
6. Final Processing
– Electrical testing
– Visual inspection
– Packaging
Our production capabilities support various advanced technologies:
– High-Density Interconnect (HDI):
Microvias and fine line/space (3/3 mil)
– Heavy Copper:
Up to 6oz inner layers
– Mixed Materials:
Hybrid constructions with high-frequency materials
– Specialty Finishes:
Hard gold, immersion silver, ENEPIG
The facility maintains full material traceability with batch-controlled inventory management. Production documentation includes:
– Material certifications
– Process control records
– Test reports
– Certificates of compliance
With continuous investment in new equipment and process improvements, our PCB production delivers:
– 99.5% on-time delivery
– First-pass yield over 98%
– Technical support for design optimization
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