Quick Turn PCB Assembly
Quick Turn PCB Assembly
Leveraging 13 years of precision manufacturing, our quick-turn service delivers functional PCBAs in 24–72 hours with >99% first-pass success rate, eliminating costly redesign loops. Key advantages include:
- Seamless Co-Engineering: Free DFM analysis within 6 hours on Gerber/BOM files, resolving impedance mismatches (±5%) and thermal risks pre-assembly.
- Supply Chain Agility: Direct sourcing from Arrow/Avnet/Digi-Key with real-time obsolescence monitoring, slashing component lead time to 48 hours for 90% parts .
- Scalable Throughput: MES-driven production lines support batches from 1-piece prototypes to 10K+ volumes without quality compromise.
Precision Accelerated by Industry 4.0 Infrastructure
A. Advanced Assembly Technologies
- Micro-Scale Expertise: Handles 0.15mm QFP, 0.2mm BGA, and 0201 components via nitrogen reflow (void rate <20%), validated by 3D AOI/X-ray 14.
- Flex/Rigid-Flex Mastery: Supports 32-layer HDI designs with laser-drilled microvias (±10μm tolerance) and impedance-controlled routing (<0.5dB loss at 10GHz) 1.
B. Integrated Testing & Validation
- IoT-Enabled Quality Gates: In-circuit (ICT), functional (FCT), and thermal cycling (-40°C~125°C) with cloud-synced reports 7.
- HyperLynx Signal Simulation: Pre-layout EMI risk reduction by 70% for high-speed DDRx and RF modules 2.
Proactive Risk Mitigation System
- Real-Time MES Monitoring: Auto-halts lines if solder defects exceed IPC-A-610 Class 3 limits (e.g., reflow profile deviation >±3°C) 47.
- X-ray/AOI Combo: 100% inspection of hidden joints and micro BGAs, ensuring CAD-to-assembly alignment 18.
- Full Material DNA Tracking: Component batch data + test logs accessible via client portal for ISO 13485/IATF 16949 audits 3.
- Certifications: IATF 16949 (automotive), ISO 13485 (medical), IPC-A-610H Class 3.
Industry-Specific Quick-Turn Advantages
| Industry | Accelerated Workflow |
| Medical | Biocompatible coatings • Class 8 cleanroom • RoHS/REACH compliance |
| Automotive | AEC-Q200 parts • Vibration-resistant layouts • -40°C~150°C thermal cycling |
| 5G Telecom | Low-Dk materials • <0.3mm microvia HDI • EMI shielding |
| Industrial IoT | Conformal coating (IP67) • DIN-rail ready designs • Wireless BLE/WiFi pre-pairing |
Key Quick-Turn
| Capability | Specification | Standard |
| Max PCB Size | 680 × 550mm | Custom panelization |
| Min. BGA Pitch | 0.2mm | X-ray validation 1 |
| SMT Placement Accuracy | ±25µm | IPC-9851 |
| Lead Time (1-10pcs) | 24h (SMT) / 48h (full turnkey) | MES analytics 4 |
| Thermal Cycling Range | -40°C to 125°C | IEC 60068 |
| On-time Delivery Rate | >99.5% (past 36 months) | Client audit logs |
