Precision BGA Assembly Services

Our BGA assembly leverages cutting-edge Surface Mount Technology (SMT) with placement accuracy under ±30µm and support for ultra-fine pitches down to 0.15mm QFP/0.2mm BGA 27. Utilizing high-speed pick-and-place systems (60,000 CPH) and nitrogen reflow soldering, we ensure void rates below 20% for robust solder joints in high-density designs. Capable of handling packages including POP, CGA, QFN, LGA, and 0.25mm² micro BGAs (0201 components), our process guarantees signal integrity and thermal management for mission-critical applications

Zero-Defect Manufacturing & Testing

Multi-stage inspection protocols enforce reliability

X-ray Imaging: 100% examination of hidden solder joints and ball grid arrays.

AOI (Automated Optical Inspection): Layer-by-layer validation against CAD models.

Functional Testing (FCT/ICT): In-circuit and burn-in tests under simulated operating conditions 23.

Certified to IPC-A-610H, ISO 9001, and IATF 16949, we implement
traceable material sourcing from authorized distributors (Arrow, Avnet, Digi-Key) to eliminate counterfeit risks

DFM-Driven Engineering Support

Mitigate assembly failures through proactive DFM analysis

Stress-Sensitive Component Placement: Avoid PCB bending zones (e.g., >10mm from board edge) and reinforce BGA corners with underfill adhesives 6.

Panelization Optimization: Automated panel replication maximizes material utilization (e.g., 640×580mm max panel size), reducing waste by 15–30% 18.

Thermal Management: Copper-core substrates and selective ENIG surface finishes dissipate heat in high-power ICs 27.
Submit Gerber/BOM files for free design validation → 24-hour feedback cycle.