Robust Board Construction
Base Materials: FR-4 High Tg (170–180°C), Polyimide for flex-rigid boards
Layer Count: 4–16 layers, including HDI configurations
Surface Finishes: ENIG, Immersion Silver, Lead-Free HASL
Conformal Coating: Optional acrylic, silicone, or urethane (IPC-CC-830B compliant)
Operating Temperature: -40°C to +125°C
Industrial-Grade Components
Processors: ARM Cortex-R/M, x86 SoCs (BGA/LGA)
Isolation: Digital isolators, optocouplers (SOIC, DIP/SMD)
Power: Industrial PMICs, POL converters (QFN, TOLL)
Interfaces: CAN, Profibus, EtherCAT, Modbus (TQFP/LQFP)
I/O Protection: TVS diodes, surge suppressors (SOT-23, DFN)
Memory: Industrial DDR3/4, NOR/NAND Flash (TSOP/BGA)
Connectors: MIL-spec, IP67-rated, terminal blocks
Certifications & Quality Standards
Quality Assurance: IPC-A-610 Class 3 (Class 3++ available)
Safety Compliance: UL 61010-1, IEC 61131-2
Environmental Standards: RoHS 2/3, REACH, ISO 14001
Process Management: ISO 9001, IATF 16949, ESD S20.20
Traceability: Full MES-based component-level tracking
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